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 SUM110N08-10
Vishay Siliconix
N-Channel 75-V (D-S) MOSFET
PRODUCT SUMMARY
V(BR)DSS (V)
75
FEATURES
rDS(on) (W) ID (A)
110
0.010 @ VGS = 10 V
D TrenchFETr Power MOSFET D New Low Thermal Resistance Package
APPLICATIONS
D Automotive - Boardnet 42-VEP and ABS - Motor Drives D High Current D DC/DC Converters
D
TO-263
G
G
DS S N-Channel MOSFET
Top View Ordering Information: SUM110N08-10
ABSOLUTE MAXIMUM RATINGS (TC = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 175_C) Pulsed Drain Current Avalanche Current Repetitive Avalanche Energya Maximum Power Dissipationa Operating Junction and Storage Temperature Range L = 0.1 mH TC = 25_C TA = 25_C c TC = 25_C TC = 125_C
Symbol
VDS VGS ID IDM IAR EAR PD TJ, Tstg
Limit
75 "20 110 63a 350 75 280 200b 3.7 -55 to 175
Unit
V
A
mJ W _C
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambient Junction-to-Case Notes a. Duty cycle v 1%. b. See SOA curve for voltage derating. c. When mounted on 1" square PCB (FR-4 material). PCB Mountc
Symbol
RthJA RthJC
Limit
40 0.75
Unit
_C/W
Document Number: 71838 S-32413--Rev. C, 24-Nov-03
www.vishay.com
1
SUM110N08-10
Vishay Siliconix
SPECIFICATIONS (TJ =25_C UNLESS OTHERWISE NOTED)
Parameter Static
Drain-Source Breakdown Voltage Gate-Threshold Voltage Gate-Body Leakage V(BR)DSS VGS(th) IGSS VDS = 0 V, ID = 250 mA VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 75 V, VGS = 0 V Zero Gate Voltage Drain Current g On-State Drain Currenta IDSS ID(on) VDS = 75 V, VGS = 0 V, TJ = 125_C VDS = 75 V, VGS = 0 V, TJ = 175_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 30 A Drain-Source On-State Resistancea Forward Transconductancea rDS(on) gfs VGS = 10 V, ID = 30 A, TJ = 125_C VGS = 10 V, ID = 30 A, TJ = 175_C VDS = 15 V, ID = 30 A 30 120 0.0055 0.010 0.0185 0.0245 S W 75 2.5 4.0 "100 1 50 250 A m mA V nA
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Chargec Gate-Source Chargec Gate-Drain Chargec Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf VDD = 35 V, RL = 0.4 W ID ^ 110 A, VGEN = 10 V, RG = 2.5 W VDS = 35 V, VGS = 10 V, ID = 110 A , , VGS = 0 V, VDS = 25 V, f = 1 MHz 5250 700 310 90 24 27 20 100 45 75 30 150 70 115 ns 165 nC pF
Turn-On Delay Timec Rise Timec Turn-Off Delay Timec Fall Timec
Source-Drain Diode Ratings and Characteristics (TC = 25_C)b
Continuous Current Pulsed Current Forward Voltagea Reverse Recovery Time Peak Reverse Recovery Current Reverse Recovery Charge IS ISM VSD trr IRM(REC) Qrr IF = 85 A, di/dt = 100 A/ms IF = 110 A, VGS = 0 V 1.0 75 3.5 0.13 110 350 1.5 120 7 0.30 A V ns A mC
Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature.
www.vishay.com
2
Document Number: 71838 S-32413--Rev. C, 24-Nov-03
SUM110N08-10
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
250 VGS = 10 thru 6 V 200 I D - Drain Current (A) I D - Drain Current (A) 160 200
Transfer Characteristics
150
120
100
5V
80 TC = 125_C 40 25_C -55_C
50
0 0 2 4 6 8 10 VDS - Drain-to-Source Voltage (V)
0 0 1 2 3 4 5 6 VGS - Gate-to-Source Voltage (V)
Transconductance
200 TC = -55_C r DS(on) - On-Resistance ( W ) 160 g fs - Transconductance (S) 25_C 0.008 0.010
On-Resistance vs. Drain Current
VGS = 10 V
120
125_C
0.006
80
0.004
40
0.002
0 0 15 30 45 60 75 90
0.000 0 20 40 60 80 100 120
ID - Drain Current (A)
ID - Drain Current (A)
8000 7000
Capacitance
20 VDS = 35 V ID = 85 A
Gate Charge
V GS - Gate-to-Source Voltage (V)
C - Capacitance (pF)
6000 5000 4000 3000 2000 1000 0 0 15 30 Crss
Ciss
16
12
8
Coss
4
0 45 60 75 0 30 60 90 120 150 180 VDS - Drain-to-Source Voltage (V) Qg - Total Gate Charge (nC) www.vishay.com
Document Number: 71838 S-32413--Rev. C, 24-Nov-03
3
SUM110N08-10
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
2.5
On-Resistance vs. Junction Temperature
VGS = 10 V ID = 30 A I S - Source Current (A)
100
Source-Drain Diode Forward Voltage
r DS(on) - On-Resistance (W) (Normalized)
2.0
1.5
10
TJ = 150_C
TJ = 25_C
1.0
0.5
0.0 -50
-25
0
25
50
75
100
125
150
175
1 0
0.3
0.6
0.9
1.2
TJ - Junction Temperature (_C)
VSD - Source-to-Drain Voltage (V)
1000
Avalanche Current vs. Time
100
Drain Source Breakdown vs. Junction Temperature
100 V (BR)DSS (V) I Dav (a)
94
ID = 250 mA
88
10
IAV (A) @ TA = 25_C
82 1 IAV (A) @ TA = 150_C 0.1 0.00001 0.0001 0.001 0.01 0.1 1 tin (Sec) 70 -50 -25 0 25 50 75 100 125 150 175
76
TJ - Junction Temperature (_C)
www.vishay.com
4
Document Number: 71838 S-32413--Rev. C, 24-Nov-03
SUM110N08-10
Vishay Siliconix
THERMAL RATINGS
Maximum Avalanche and Drain Current vs. Case Temperature
120 100 100 I D - Drain Current (A) 80 60 40 20 0 0 25 50 75 100 125 150 175 TC - Ambient Temperature (_C) 0.1 0.1 1 10 100 VDS - Drain-to-Source Voltage (V) I D - Drain Current (A) 100 ms 10 1 ms 10 ms 100 ms dc 1000
Safe Operating Area
Limited by rDS(on)
10 ms
1
TC = 25_C Single Pulse
2 1 Normalized Effective Transient Thermal Impedance Duty Cycle = 0.5 0.2
Normalized Thermal Transient Impedance, Junction-to-Case
0.1
0.1 0.05 0.02 Single Pulse
0.01 10-4
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (sec)
Document Number: 71838 S-32413--Rev. C, 24-Nov-03
www.vishay.com
5


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